IPCB/B. Rework, Modification and Repair of Electronic Assemblies. Developed by the Repairability Subcommittee () of the Product Assurance. These procedures are new additions to the IPCB/B. Material in this manual, IPC/ Rework, Modification and Repair of. IPCBB - Download as PDF File .pdf), Text File .txt) or read online. IPCBB.
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IPCB/B Change 1. November 1, Rework, Modification and Repair of Electronic Assemblies. Developed by the Repairability Subcommittee. SMTA Great Lakes Chapter Meeting. “IPCB/B Rework, Repair and Modification”. Presented By: Frank Honyotski. Master IPC Trainer (MIT). IPC supersedes IPC-RC. As technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-.
Maher, Peter E. Meeks, Jr.
Rework, Modification and Repair of Electronic Assemblies (Czech Version)
Miller, Christine A. Neumark, Yori, Hadco Corp. Nicol, David Northam, Riley L. Rowe, Teresa M. Services Inc. Scott, Patricia A. Smith, Rick B. Sober, Douglas J.
Steele, David B. Steen, Wayne A.
Thompson, Ronald E. Ventress, Sharon T. Youngblood, Don, Honeywell Inc. In this regard document sets are used to provide the total information related to a particular electronic packaging topic.
When used together, these documents should lead both manufacturer and customer to consistent terms of acceptability. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee of the Product Assurance Committee of the IPC. It is possible that alternate equipment and processes can be used to make the same repair.
If alternate equipment is used, it is up to the user to determine that the resultant assembly is good and undamaged. The manufacturer or supplier must not impose or allow any variation from these requirements on subcontracts or download orders other than those that have been approved by the user. However, the manufacturer of these items may comply as deemed appropriate. This manual is designed to help you repair, rework and modify PC boards reliably.
Procedures contained herein were submitted for inclusion by commercial and military organizations too numerous to list individually. Repairs are generally changes to an unacceptable end product to make it acceptable in accordance with original functional requirements.
The control of repaired products should be by means of Material Review Board MRB , or its equivalent, which may consist of 1 May 1. Proper training needs to be in place to ensure quality and reliability of the assembly.
Generally all that is needed is to understand those differences. When the electrical energy is allowed to come in contact with or even close to a sensitive component it can cause damage to the component. The relative sensitivity of a component to ESD is dependent upon its construction and materials.
As components become smaller and operate faster, the sensitivity increases. Electrical Overstress EOS is the internal result of a unwanted application of electrical energy that results in damaged components This damage can be from many different sources, such as electrically powered process equipment or ESD occurring during handling or processing.
ESDS components can fail to operate or change in value as a result of improper handling or processing. These failures can be immediate or latent. The result of immediate failure can be additional testing and rework or scrap. However the consequences of latent failure are the most serious. Even though the product may have passed inspection and functional test, it may fail after it has been delivered to the customer.
However, in the manufacturing and assembly areas, we often work with unprotected electronic assemblies that are attached to the ESDS components. This section will be dedicated to safe handling of these unprotected electronic assemblies. For that purpose, the following subjects are addressed: 2. This unwanted elec- trical energy can be the result of ESD potentials or the result of electrical spikes caused by the tools we work with, such as soldering irons, soldering extractors, testing instruments or other electrically operated process equipment.
Some devices are more sensitive than others. The degree of sensitivity is a function of the design of the device. Generally speaking higher speed and smaller devices are more susceptible than their slower, larger predecessors. The purpose or family of the device also plays an important part in component sensitivity. This is because the design of the component can allow it to react to smaller electrical sources or wider frequency ranges.
With todays products in mind, we can see that EOS is a more serious problem than it was even a few years ago.
It will be even more critical in the future. When considering the susceptibility of the product we must keep in mind the susceptibility of the most sensitive component in the assembly. Applied unwanted electrical energy can be processed or conducted just as an applied signal would be during circuit performance. Before handling or processing sensitive components, tools and equipment need to be carefully tested to ensure that they do not generate damaging energy, including spike voltages.
Current research indicates that voltages and spikes less than 0. However, an increasing number of extremely sensitive components require that soldering irons, solder extractors, test instruments and other equipment must never generate spikes greater than 0.
As required by most ESD specifications including EIA, periodic testing may be warranted to preclude damage as equipment performance may degrade with use over time. Maintenance programs are also necessary for process equipment to ensure the continued ability to not cause EOS damage. EOS damage is certainly similar in nature to ESD damage, since damage is the result of undesirable electrical energy. All ESD protection techniques and products address one or both of the two issues.
This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC. Page 1 of 4 Number: 2. Static sources are all around us. The degree of static generated is relative to the characteristics of the source. To generate energy relative motion is required. This could be contacting, separation, or rubbing of the material.
Most of the serious offenders are insulators since they concentrate energy where it was generated or applied rather than allowing it to spread across the surface of the material. Common materials such as plastic bags or Styrofoam containers are serious static generators and as such are not to be allowed in processing areas especially static safe areas.
Re-certification training is conducted at the Authorized Certification Centers. Below is a sample of the drag soldering technique. The session also covers wire tinning using a soldering iron and a solder pot. Students are graded on the IPC Class 3 criteria on installations of various axial and radial leaded devices using conductive applications. The student will watch the IPC video VT, Through Hole Rework, instructed on proper stress relief bends and the proper use of vacuum extraction handpieces.
The student will also have the opportunity to use a solder flow fountain to remove and install multi-leaded PTH devices. Lastly the student will be instructed in the workmanship standards associated with PTH configurations. Students remove components using various conductive tips and focused hot air.
Appropriate workmanship standards are reviewed and students must install and remove components to the IPC Class 3 criteria. Please contact us if accommodation is required.
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Course participants are given an opportunity to learn new practical skills to ensure that rework and repair is done right first time. While there are no formal entrance requirements, Certified IPC Trainer candidates must have excellent hand soldering skills. In addition, it is now updated with additional support for lead free, BGAs and flex-print repairs. This program provides Certified IPC Trainers and their companies with a valuable industry-recognized credential.
Rwk-Rep Training Equipment List. Additional languages are continuously being added.Generally speaking higher speed and smaller devices are more susceptible than their slower, larger predecessors. Students will repair a burn on a PCB by excavating the damaged material, mixing two-part epoxy, using the epoxy to fill the damaged area, and the use of coloring agents to match the PCB color.
NOTE: If excess solder exists use wicking braid and iron to remove solder. This is because the design of the component can allow it to react to smaller electrical sources or wider frequency ranges. Many sensitive assemblies will also be marked on the assembly itself, usually on an edge connector. Nicol, David Northam, Riley L.
Apply flux to one land optional. Worldwide Dennehy, Charles S. Contamination Contamination by handling with bare hands or fingers without some form of protection causes soldering and coating problems; body salts and oils, and unauthorized hand creams are typical contaminants.