CS5461A DATASHEET PDF

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Cs5461a Datasheet Pdf

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I'll be really very grateful. MAX 3-V to 5. The MAX device consists of two line drivers, two. The MAX device consists of two line drivers, two line receivers, and a dual charge-pump circuit with. All Mikroelektronika's development systems feature a large number of peripheral modules expanding microcontroller's range of application RS To 3. This manual contains the following chapters Maxim MAX The RS specification states that any line can be shorted to ground, mark level, space Max RS chip.

Flag for inappropriate content. IBM Builds Graphene Cable termination AS Datasheet en v6. The test switches aid in debug-ging communication problems Temperature Figure Supply 2. Reference Output Spread Figure Internal Reference Voltage vs. Temperature Grade B Rev. C Page 13 of 28 0. Gain Error and Full-Scale Error vs.

Supply Voltage T —0. Internal Reference Noise, 0. Internal Reference Noise Spectral Density vs. C Page 14 of 28 3. Noise Spectral Density vs. Supply Current vs. Temperature —0. Digital-to-Analog Glitch Impulse Rev. C Page 15 of 28 6 7 —0. Capacitive Load vs. Multiplying Bandwidth, External Reference 2. Total Harmonic Distortion at 1 kHz 6 0. Exiting Power-Down to Midscale Figure Power-On Reset to 0 V Rev. Differential Nonlinearity DNL Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes.

This DAC is guaranteed monotonic by design. Zero Code Error Zero code error is a measurement of the output error when zero code 0x is loaded to the DAC register. Ideally, the output must be 0 V. Zero code error is expressed in mV. A plot of zero code error vs. See Figure 23 and Figure 26 for plots of full-scale error. Zero-Code Error Drift Zero-code error drift is a measurement of the change in zerocode error with a change in temperature.

Gain Temperature Coefficient Gain temperature coefficient is a measurement of the change in gain error with changes in temperature. It can be negative or positive. Digital-to-Analog Glitch Impulse Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-sec and is measured when the digital input code is changed by 1 LSB at the major carry transition 0x7FFF to 0x , as shown in Figure Digital Feedthrough Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC, but it is measured when the DAC output is not updated.

Digital feedthrough is specified in nV-sec and measured with a full-scale code change on the data bus, that is, from all 0s to all 1s and vice versa. Reference Feedthrough Reference feedthrough is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated. It is expressed in dB.

Output Noise Spectral Density Noise spectral density is a measurement of the internally generated random noise. It is measured by loading the DAC to midscale and measuring noise at the output. See Figure 31, Figure 34, and Figure 35 for a plot of noise spectral density.

The noise spectral density for the internal reference is shown in Figure 30 and Figure The multiplying bandwidth is a measure of this finite bandwidth. A sine wave on the reference with full-scale code loaded to the DAC appears on the output.

The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input.

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It is measured in dB. VREFmin is the minimum reference output measured over the total temperature range. VREFnom is the nominal reference output voltage, 2. The devices operate from supply voltages of 2. The simplified segmented resistor string DAC structure is shown in Figure The code loaded to the DAC register determines the switch on the string that is connected to the output buffer. Because each resistance in the string has same value, R, the string DAC is guaranteed monotonic.

For users that need an external reference, the AD is available. The input coding to the DAC is straight binary. Gain is the gain of the output amplifier.

Figure 47 shows the internal block diagram. VREF 2.

Parametric Specifications

The internal reference is available at the VREF pin. It is internally buffered and capable of driving external loads of up to 50 mA. Before connecting an external reference to the pin, disable the internal reference by writing to the REF bit Bit DB16 in the write control register.

Figure If a higher capacitance load is required, use the snubber method or a shunt resistor to isolate the load from the output amplifier. The slew rate is 0.

The output buffer voltage is determined by VREF, the gain bit, and the offset and gain errors. See Figure 4 for a timing diagram of a typical write sequence. If SYNC is brought high before 16 falling clock edges, the serial write is ignored and the write sequence is considered invalid. To increase the DAC update rate, the size of the data-word can be reduced. The serial data output pin SDO , which is available only in the ADR, serves two purposes: to read back the contents of the DAC registers and to connect the device in daisy-chain mode.

The SDO pin contains a push-pull output that internally includes a weak pull-down resistor. The data is clocked out of SDO on the rising edge of SCLK, as shown in Figure 4, and the pin is active only when the DCEN bit is enabled in the write control register or automatically enabled during a readback command.

In standby mode, the internal pull-down resistor forces a Logic 0 on the bus.

Connecting digital pin to digital pin.

Due to the high value of the internal pull-down resistor, other devices can have control over the SDO line if a parallel connection is made. If SYNC is brought high after 24 falling clock edges, it is interpreted as a valid write, and the first 24 bits are loaded to the input shift register. To minimize power consumption, it is recommended that all serial interface pins be operated close to the supply rails.

The clock period may need to be increased, as shown in Table 4, because of the propagation delay of the line between subsequent devices. By default, the SDO pin is disabled. To enable daisy-chain operation, the DCEN bit must be set in the write control register see Table Daisy-Chain Timing Diagram Rev. The input register allows the preloading of a new value for the DAC register.

The command is decoded on the rising edge of SYNC. This register does not control the voltage in the VOUT pin. There are two different ways to transfer the contents of the input register to the DAC register: by software or by hardware. This operation is equivalent to a software LDAC. This command updates the DAC register on completion of the write operation.

The input register is refreshed automatically with the DAC register value. This register can be updated by issuing a command or by transferring the contents of the input register to the DAC register. Table 9.

The write control register sets the power-down and gain functions. See Table 10 for the write control register functionality.

Table This bit is automatically disabled when a readback command is executed. Enabling this bit disables the write short command feature in the ADR. In power-down mode, the device disables the output buffer but does not disable the internal reference. To achieve maximum power savings, it is recommend to disable the REF bit, if possible. Table 12 shows how the output voltage range corresponds to the state of the gain bit.

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This reference can be turned on or off by setting a software-programmable bit, DB16, in the write control register. Table 13 shows how the state of the bit corresponds to the mode of operation. To reduce the power consumption, it is recommended to disable the internal reference if the device is placed in powerdown mode.

The output amplifier is shut down when the power-down mode is activated. However, unless the internal reference is powered down using Bit DB16 in the write control register , the bias generator, reference, and resistor string remain on. When in power-down mode, the weak SDO resistor is also disconnected.The clock period may need to be increased, as shown in Table 4, because of the propagation delay of the line between subsequent devices.

Single Phase Power/Energy IC

Table 2. Designed for residential single-phase or industrial three phase power-meter applications, the IC accurately measures instantaneous current and voltage while calculating instantaneous power, real power, apparent power, I RMS and V RMS. Trademarks and registered trademarks are the property of their respective owners. C Page 13 of 28 0. Zero Code Error and Offset Error vs.

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